On-die monitors, localized analytics, and lifecycle data are giving architects new ways to close the gap between design ...

When is a complex chip design ready to be shipped to manufacturing?

NVMe on-controller memory; SSN datapaths; Git-based chip workflows; low-light image enhancement; testing AI networks.

Researchers from Google and University of California, Berkeley published a technical paper titled “Google’s Training ...

Jim Handy of Objective Analysis and Jawad Nasrullah from Palo Alto Electron kicked off last week’s Chiplet Summit with predictions about where the chiplet market is headed and why chiplets are needed ...

Researchers from University of Wisconsin-Madison and AMD Research and Advanced Development published a technical paper titled ...

Researchers from Seoul National University, Stanford University, and Chinese Academy of Sciences developed an ...

Scaling to tens of millions of CPO units per year requires the industry to first settle on automated, cost-effective methods ...

Advanced node manufacturing and heterogeneous integration require partnerships that span the full value chain.

Standalone GPUs are being replaced by heterogeneous SoCs and chiplets that combine CPUs, GPUs, and NPUs to eliminate memory ...

This post addresses the specific hurdle of effective and efficient manufacturing tests for these complex devices. It outlines ...

Yu Ma. As AI-driven workloads continue to push the boundaries of compute scale, power efficiency, and bandwidth density, ...